{"id":11420,"date":"2026-06-14T11:01:51","date_gmt":"2026-06-14T09:01:51","guid":{"rendered":"https:\/\/www.hwlegend.tech\/overclock\/?p=11420"},"modified":"2026-06-14T11:01:51","modified_gmt":"2026-06-14T09:01:51","slug":"asetek-rivoluziona-il-liquid-cooling-a-computex-2026-con-la-piattaforma-emma-v3","status":"publish","type":"post","link":"https:\/\/www.hwlegend.tech\/overclock\/varie\/news\/asetek-rivoluziona-il-liquid-cooling-a-computex-2026-con-la-piattaforma-emma-v3\/","title":{"rendered":"Asetek rivoluziona il liquid cooling a COMPUTEX 2026 con la piattaforma Emma V3"},"content":{"rendered":"<hr \/>\n<p>In occasione del COMPUTEX 2026, <strong><span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">Asetek<\/span><\/span><\/strong> ha presentato la propria architettura di raffreddamento a liquido di nuova generazione, progettata per rispondere alle crescenti esigenze termiche dei sistemi dedicati all&#8217;intelligenza artificiale, alle workstation professionali e ai PC ad alte prestazioni.<\/p>\n<div id=\"thread\" class=\"group\/thread flex flex-col min-h-full\">\n<div class=\"composer-parent flex flex-1 flex-col focus-visible:outline-0\" role=\"presentation\">\n<div class=\"relative basis-auto flex-col -mb-(--composer-overlap-px) pb-(--composer-overlap-px) [--composer-overlap-px:28px] grow flex\" data-voice-floating-orb-focus-background=\"\">\n<div class=\"flex flex-col text-sm\">\n<div class=\"qMYqUG_convSearchResultHighlightRoot\">\n<div class=\"\" data-turn-id-container=\"9de048e1-ec6d-472d-89e5-250793e64008\" data-is-intersecting=\"true\">\n<section class=\"text-token-text-primary w-full focus:outline-none has-data-writing-block:pointer-events-none [&amp;:has([data-writing-block])&gt;*]:pointer-events-auto R6Vx5W_threadScrollVars scroll-mb-[calc(var(--scroll-root-safe-area-inset-bottom,0px)+var(--thread-response-height))] scroll-mt-[calc(var(--header-height)+min(200px,max(70px,20svh)))]\" dir=\"auto\" data-turn-id=\"9de048e1-ec6d-472d-89e5-250793e64008\" data-turn-id-container=\"9de048e1-ec6d-472d-89e5-250793e64008\" data-testid=\"conversation-turn-4\" data-scroll-anchor=\"false\" data-turn=\"assistant\">\n<div class=\"text-base my-auto mx-auto pb-10 [--thread-content-margin:var(--thread-content-margin-xs,calc(var(--spacing)*4))] @w-sm\/main:[--thread-content-margin:var(--thread-content-margin-sm,calc(var(--spacing)*6))] @w-lg\/main:[--thread-content-margin:var(--thread-content-margin-lg,calc(var(--spacing)*16))] px-(--thread-content-margin)\">\n<div class=\"[--thread-content-max-width:40rem] @w-lg\/main:[--thread-content-max-width:48rem] mx-auto max-w-(--thread-content-max-width) flex-1 group\/turn-messages focus-visible:outline-hidden relative flex w-full min-w-0 flex-col agent-turn\" data-conversation-screenshot-content=\"\">\n<div class=\"flex max-w-full flex-col gap-4 grow\">\n<div class=\"min-h-8 text-message relative flex w-full flex-col items-end gap-2 text-start break-words whitespace-normal outline-none keyboard-focused:focus-ring [.text-message+&amp;]:mt-1\" dir=\"auto\" data-message-author-role=\"assistant\" data-message-id=\"35deb0ea-3f8d-432d-b943-9f5cf599365d\" data-turn-start-message=\"true\" data-message-model-slug=\"gpt-5-5\">\n<div class=\"flex w-full flex-col gap-1 empty:hidden\">\n<div class=\"markdown prose dark:prose-invert wrap-break-word w-full dark markdown-new-styling\">\n<p data-start=\"710\" data-end=\"1058\">L&#8217;evoluzione dell&#8217;AI generativa, dell&#8217;High Performance Computing (HPC) e delle moderne CPU multi-core sta infatti imponendo requisiti sempre pi\u00f9 severi in termini di dissipazione del calore.<\/p>\n<p data-start=\"710\" data-end=\"1058\">Per affrontare queste sfide, l&#8217;azienda ha sviluppato una nuova piattaforma capace di migliorare contemporaneamente efficienza termica e rumorosit\u00e0 operativa.<\/p>\n<hr \/>\n<p data-start=\"710\" data-end=\"1058\"><a href=\"https:\/\/www.hwlegend.tech\/wp-content\/uploads\/2026\/06\/Asetek-rivoluziona-il-liquid-cooling-a-COMPUTEX-2026-con-la-piattaforma-Emma-V3.webp\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter size-large wp-image-222397\" src=\"https:\/\/www.hwlegend.tech\/wp-content\/uploads\/2026\/06\/Asetek-rivoluziona-il-liquid-cooling-a-COMPUTEX-2026-con-la-piattaforma-Emma-V3-1024x576.webp\" alt=\"\" width=\"1024\" height=\"576\" \/><\/a><\/p>\n<hr \/>\n<p data-start=\"1060\" data-end=\"1119\"><strong>Nuova architettura termica ottimizzata per l&#8217;era dell&#8217;AI<\/strong><\/p>\n<hr \/>\n<p data-start=\"1121\" data-end=\"1363\">La principale innovazione introdotta da Asetek riguarda una nuova progettazione della cold plate caratterizzata da un offset completo di 4 mm, soluzione studiata per migliorare il contatto termico con le aree pi\u00f9 calde dei moderni processori.<\/p>\n<p data-start=\"1365\" data-end=\"1667\">Questa tecnologia consente di gestire in maniera pi\u00f9 efficace gli hotspot generati dai carichi di lavoro AI e dalle applicazioni professionali ad alta intensit\u00e0 computazionale, contribuendo a ridurre la resistenza termica e a mantenere temperature operative pi\u00f9 contenute anche sotto stress prolungato.<\/p>\n<p data-start=\"1669\" data-end=\"1957\">Parallelamente, l&#8217;azienda ha evidenziato la propria strategia industriale successiva all&#8217;integrazione con <span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">Chunqiu Electronic<\/span><\/span>, che combina l&#8217;esperienza ingegneristica sviluppata in Danimarca con una maggiore capacit\u00e0 produttiva e una supply chain globale basata in Asia.<\/p>\n<hr \/>\n<p data-start=\"1959\" data-end=\"2015\"><strong>Emma V3 [Gen10]: la nuova generazione dei sistemi AIO<\/strong><\/p>\n<hr \/>\n<p data-start=\"2017\" data-end=\"2206\">Il debutto pi\u00f9 importante della manifestazione \u00e8 rappresentato dalla piattaforma Emma V3 [Gen10], nuova evoluzione della famiglia di sistemi di raffreddamento All-in-One (AIO) dell&#8217;azienda.<\/p>\n<hr \/>\n<p data-start=\"2208\" data-end=\"2315\">Secondo i dati forniti dal produttore, rispetto alla generazione precedente la nuova architettura consente:<\/p>\n<hr \/>\n<ul data-start=\"2317\" data-end=\"2567\">\n<li data-start=\"2317\" data-end=\"2368\">riduzione della resistenza termica pari a 1,5 \u00b0C;<\/li>\n<li data-start=\"2369\" data-end=\"2422\">diminuzione della rumorosit\u00e0 percepita fino al 45%;<\/li>\n<li data-start=\"2423\" data-end=\"2514\">maggiore flessibilit\u00e0 nell&#8217;integrazione con le piattaforme hardware di nuova generazione;<\/li>\n<li data-start=\"2515\" data-end=\"2567\">migliore gestione degli hotspot delle CPU moderne.<\/li>\n<\/ul>\n<hr \/>\n<p data-start=\"2569\" data-end=\"2810\">Dal punto di vista progettuale, Emma V3 utilizza una struttura dual-offset, kit di ritenzione ottimizzati e microcanali con scanalatura centrale, elementi sviluppati per massimizzare lo scambio termico nelle aree pi\u00f9 critiche del processore.<\/p>\n<p data-start=\"2812\" data-end=\"3093\">La piattaforma verr\u00e0 adottata inizialmente all&#8217;interno dell&#8217;ecosistema <span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">TRYX<\/span><\/span> e sar\u00e0 inoltre protagonista di una speciale soluzione premium sviluppata da <span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">ASUS<\/span><\/span> per la linea gaming <span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">ROG<\/span><\/span>.<\/p>\n<hr \/>\n<p data-start=\"3095\" data-end=\"3141\"><strong>Ingrid [G9]: espansione dell&#8217;offerta gaming<\/strong><\/p>\n<hr \/>\n<p data-start=\"3143\" data-end=\"3278\">Accanto alla nuova Emma V3, Asetek ha confermato l&#8217;espansione della piattaforma Ingrid [G9], gi\u00e0 introdotta sul mercato lo scorso anno.<\/p>\n<p data-start=\"3280\" data-end=\"3394\">Durante COMPUTEX 2026 diversi partner hanno presentato nuovi dissipatori AIO basati su questa tecnologia, tra cui:<\/p>\n<hr \/>\n<ul data-start=\"3396\" data-end=\"3515\">\n<li data-start=\"3396\" data-end=\"3435\"><span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">ADATA;<\/span><\/span><\/li>\n<li data-start=\"3436\" data-end=\"3475\"><span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">NZXT;<\/span><\/span><\/li>\n<li data-start=\"3476\" data-end=\"3515\"><span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">TRYX.<\/span><\/span><\/li>\n<\/ul>\n<hr \/>\n<p data-start=\"3517\" data-end=\"3679\">La piattaforma Ingrid promette una riduzione delle temperature della CPU fino a 3 \u00b0C rispetto alle soluzioni precedenti, articolandosi in due varianti principali.<\/p>\n<hr \/>\n<p data-start=\"3681\" data-end=\"3702\"><strong>Ingrid Mainstream<\/strong><\/p>\n<hr \/>\n<p data-start=\"3704\" data-end=\"3980\">La versione Mainstream punta a offrire prestazioni elevate unite a una rumorosit\u00e0 estremamente contenuta, compresa tra 18 e 20 dB(A) a una distanza di 25 centimetri. Il design integra inoltre ventole preinstallate per semplificare il montaggio e migliorare l&#8217;esperienza d&#8217;uso.<\/p>\n<hr \/>\n<p data-start=\"3982\" data-end=\"3998\"><strong>Ingrid Value<\/strong><\/p>\n<hr \/>\n<p data-start=\"4000\" data-end=\"4279\">La variante Value, sviluppata insieme ad ADATA attraverso la piattaforma Levante View, mantiene la stessa architettura termica di base ma si rivolge a una fascia di mercato pi\u00f9 accessibile, ampliando la diffusione delle tecnologie di raffreddamento avanzato tra gli appassionati.<\/p>\n<hr \/>\n<p data-start=\"4281\" data-end=\"4345\"><strong>Nuove soluzioni per workstation Intel Xeon e AMD Threadripper<\/strong><\/p>\n<hr \/>\n<p data-start=\"4347\" data-end=\"4490\">Uno degli aspetti pi\u00f9 rilevanti della presentazione riguarda il crescente interesse di Asetek verso il segmento workstation professionale e AI.<\/p>\n<p data-start=\"4492\" data-end=\"4657\">Durante l&#8217;evento saranno infatti esposte soluzioni di raffreddamento dedicate ai processori Intel Xeon presso gli stand ASUS e <span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">Phanteks<\/span><\/span>.<\/p>\n<p data-start=\"4659\" data-end=\"4804\">Parallelamente, Phanteks e <span class=\"hover:entity-accent entity-underline inline cursor-pointer align-baseline\"><span class=\"whitespace-normal\">Antec<\/span><\/span> presenteranno sistemi AIO compatibili con i processori AMD Ryzen Threadripper.<\/p>\n<p data-start=\"4806\" data-end=\"5082\">Le nuove soluzioni workstation sono caratterizzate da una copertura completa dell&#8217;Integrated Heat Spreader (IHS), permettendo di gestire processori con consumi superiori a 450 watt di TDP, un valore significativamente superiore rispetto alle tradizionali piattaforme consumer.<\/p>\n<hr \/>\n<p data-start=\"5084\" data-end=\"5154\"><strong>Il raffreddamento a liquido diventa infrastruttura critica per l&#8217;AI<\/strong><\/p>\n<hr \/>\n<p data-start=\"5156\" data-end=\"5484\">Le novit\u00e0 mostrate da Asetek a COMPUTEX 2026 evidenziano una tendenza ormai consolidata nel settore hardware: il raffreddamento non rappresenta pi\u00f9 un semplice componente accessorio, ma una vera infrastruttura tecnologica indispensabile per sostenere l&#8217;evoluzione dell&#8217;intelligenza artificiale e del calcolo ad alte prestazioni.<\/p>\n<p data-start=\"5486\" data-end=\"5764\" data-is-last-node=\"\" data-is-only-node=\"\">Con Emma V3 e l&#8217;espansione della famiglia Ingrid, l&#8217;azienda punta a rafforzare la propria presenza sia nel mercato enthusiast sia nel segmento professionale, offrendo soluzioni capaci di supportare le future generazioni di workstation AI, server e sistemi gaming di fascia alta.<\/p>\n<hr \/>\n<p style=\"text-align: center\" data-start=\"5486\" data-end=\"5764\" data-is-last-node=\"\" data-is-only-node=\"\"><strong>HW Legend Overclock Staff<\/strong><\/p>\n<hr \/>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"gsp_post_data\" \r\n\t            data-post_type=\"post\" \r\n\t            data-cat=\"news\" \r\n\t            data-modified=\"96\"\r\n\t            data-created=\"1781434911\"\r\n\t            data-title=\"Asetek rivoluziona il liquid cooling a COMPUTEX 2026 con la piattaforma Emma V3\" \r\n\t            data-home=\"https:\/\/www.hwlegend.tech\/overclock\"><\/div>","protected":false},"excerpt":{"rendered":"<p>In occasione del COMPUTEX 2026, Asetek ha presentato la propria architettura di raffreddamento a liquido di nuova generazione, progettata per rispondere alle crescenti esigenze termiche dei sistemi dedicati all&#8217;intelligenza artificiale, alle workstation professionali e ai PC ad alte prestazioni. L&#8217;evoluzione dell&#8217;AI generativa, dell&#8217;High Performance Computing (HPC) e delle moderne CPU multi-core sta infatti imponendo requisiti [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":11423,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[6],"class_list":["post-11420","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Asetek rivoluziona il liquid cooling a COMPUTEX 2026 con la piattaforma Emma V3 - HW Legend Overclock<\/title>\n<meta name=\"description\" content=\"Asetek svela Emma V3 a COMPUTEX 2026: raffreddamento a liquido pi\u00f9 efficiente, silenzioso e ottimizzato per AI e workstation.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, 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